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  • UV-Visible, Ultraviolet-Visible Spectrophotometer

  • It is used to be measured density of additives in plating fluid and chemicals.

  • It is used to be measured density of additives in plating fluid and chemicals

  • It is used to be measured density of hazardous substances based on RoHS incoming and delivery inspection.

  • XRF, Coating Thickness Gauge

  • It is used to be measured plating thickness and density in plating layer.

  • SEM, Scanning Electron Microscope

  • It is used to be measured material surface texture by electron lay from electron source.

  • ICP, Inductively Coupled Plasma Spectrometer

  • It is used to be measured quantitative and qualitative analysis on metal, raw material, and unknown samples within plating fluid.

  • OES, Spark Optical Emission Spectrometer

  • It is used to be measured ferrous & nonferrous metals in solid state, help to managing purity by checking impurity.