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ENG
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Lead wire for interconnecting main electronic components with PCB board in order to activate each component with electrical & physical properties
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+Application
Capacitors (Electrolytic, Polymer Solid, Film, Ceramic), Resistor, Diode, Varistor, Jumper, Connector Pin.
Product and R&D
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Lead Wire
◆ Lead Wire?
◆ Process of manufacturing
- Copper Clading
- 1st drawing
- 1st annealing
- 2nd drawing
- 2nd annealing
- final product
◆ Cross Section of Wire
| Item | Cross Section |
|---|---|
| Tin Plated on Copper Covered Steel Wire TPC |
 |
| Sn+Cu Plated on Copper Covered Steel Wire TPC(C) |
 |
| Tin Plated on Annealed Copper Wire TCA |
 |
| Ag Plated on Copper Covered Steel Wire APC |
 |
| Item | Cross Section |
|---|---|
| Sn+Bi Plated on Copper Covered Steel Wire TPC(B) |
 |
| Tin(or Sn+Cu) Plated on Copper Covered Square Steel Wire TPCHFS, TPCHFS(C) |
 |
| Sn+Pb(Sn+Bi or Sn+Cu) Plated on Annealed Copper Wire 5TCA, TCA(B), TCA(C) |
 |
| Ni Plated on Copper Covered Steel Wire NPC |
 |
◆ Packing
| Type | A | B | C | D |
|---|---|---|---|---|
| Material |  |
 |
 |
 |
| Paper Box | PVC Drum | P.P Drum | Fiber Drum | |
| Dimension (mm) | 280(L) X 280(W) X 265(H) | Ø250 X 285(H) | Ø290 X 320(H) | Ø400 X 290(H) |
| Weight (kg) | 13~22 | 35~50 |
| Bobbin Type |
Dimension (mm) | Packing Weight (kg) |
||||
|---|---|---|---|---|---|---|
| D | d | B | W | L | ||
| D-250 | 250 | 160 | 22 | 160 | 200 | 20 |
| P-30 | 300 | 130 | 32 | 130 | 150 | 30 |
| P-5 | 160 | 70 | 22 | 90 | 114 | 5 |
※ Any packing requirement except the above is negotiable.