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Product and R&D
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Lead Wire
◆ Lead Wire?
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Lead wire for interconnecting main electronic components with PCB board in order to activate each component with electrical & physical properties
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+Application
Capacitors (Electrolytic, Polymer Solid, Film, Ceramic), Resistor, Diode, Varistor, Jumper, Connector Pin.
◆ Process of manufacturing
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Copper Clading
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1st drawing
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1st annealing
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2nd drawing
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2nd annealing
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final product
◆ Cross Section of Wire
| Item |
Cross Section |
Tin Plated on Copper Covered Steel Wire TPC |
 |
Sn+Cu Plated on Copper Covered Steel Wire TPC(C) |
 |
Tin Plated on Annealed Copper Wire TCA |
 |
Ag Plated on Copper Covered Steel Wire APC |
 |
| Item |
Cross Section |
Sn+Bi Plated on Copper Covered Steel Wire TPC(B) |
 |
Tin(or Sn+Cu) Plated on Copper Covered Square Steel Wire TPCHFS, TPCHFS(C) |
 |
Sn+Pb(Sn+Bi or Sn+Cu) Plated on Annealed Copper Wire 5TCA, TCA(B), TCA(C) |
 |
Ni Plated on Copper Covered Steel Wire NPC |
 |
◆ Packing
| Type |
A |
B |
C |
D |
| Material |
 |
 |
 |
 |
| Paper Box |
PVC Drum |
P.P Drum |
Fiber Drum |
| Dimension (mm) |
280(L) X 280(W) X 265(H) |
Ø250 X 285(H) |
Ø290 X 320(H) |
Ø400 X 290(H) |
| Weight (kg) |
|
13~22 |
|
35~50 |
Bobbin Type |
Dimension (mm) |
Packing Weight (kg) |
| D |
d |
B |
W |
L |
| D-250 |
250 |
160 |
22 |
160 |
200 |
20 |
| P-30 |
300 |
130 |
32 |
130 |
150 |
30 |
| P-5 |
160 |
70 |
22 |
90 |
114 |
5 |
※ Any packing requirement except the above is negotiable.
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